JPS6325739Y2 - - Google Patents
Info
- Publication number
- JPS6325739Y2 JPS6325739Y2 JP6356682U JP6356682U JPS6325739Y2 JP S6325739 Y2 JPS6325739 Y2 JP S6325739Y2 JP 6356682 U JP6356682 U JP 6356682U JP 6356682 U JP6356682 U JP 6356682U JP S6325739 Y2 JPS6325739 Y2 JP S6325739Y2
- Authority
- JP
- Japan
- Prior art keywords
- stem
- lead wire
- glass
- cap
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005253 cladding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011162 core material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 16
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 238000005245 sintering Methods 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6356682U JPS58166043U (ja) | 1982-04-30 | 1982-04-30 | 大電力半導体用ステム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6356682U JPS58166043U (ja) | 1982-04-30 | 1982-04-30 | 大電力半導体用ステム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58166043U JPS58166043U (ja) | 1983-11-05 |
| JPS6325739Y2 true JPS6325739Y2 (en]) | 1988-07-13 |
Family
ID=30073666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6356682U Granted JPS58166043U (ja) | 1982-04-30 | 1982-04-30 | 大電力半導体用ステム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58166043U (en]) |
-
1982
- 1982-04-30 JP JP6356682U patent/JPS58166043U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58166043U (ja) | 1983-11-05 |
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